We make Digital Printed Electronics and Smart 3D Printing easier worldwide

CeraPrinter

X-Serie

TurnKey Materials Deposition Inkjet Printer

CeraPrinter X-Serie is a TurnKey Materials Deposition Inkjet tool for process development in Printed Electronics and Smart 3D Printing.
Thanks to its patented rotative head-holder “plug and play”, full curing area, in-situ characterization devices and exclusive software suite, CeraPrinter X-Serie is a perfect “all inclusive” tool to enable advanced inkjet process development

Avantages

  • Designed for Inkjet Process Development in various applications
  • Quick Start-up & User-friendly tool
  • Available dedicated configurations for specific fields and markets
  • Easy Lab-to-Fab transfer

Exemples d'applications électroniques

  • HF Antenna
  • RFID
  • OPV
  • OLED
  • Interconnection
  • Printed memories
  • Photodetectors
  • Lens
  • Semiconductor
  • Biology
  • Ceramic thick lms
  • LTCC
  • Multilayer Ceramic Capacitor
  • Magnetic components
  • Temperature sensors
  • Piezoelectric actuators
  • Sol gel selective deposition
  • Photocatalytic elements
  • Fuel cells
  • Solar cells front contacts

Spécifications

  • Substrate up to 305 mm x 305 mm with thickness up to 10mm
  • High accuracy five axis with motorized adjustable printing resolution, substrate alignment (+/-2 μm) and nozzles self calibration (< +/-3 μm)
  • Up to three different printheads (more on request) to deposit aqueous, biologic, solvent and UV based inks
  • Able to print in Raster-Scan Mode (X or Y), Vector Mode (XY) and Single Pass (X or Y)

Hardware

Motion system: high accuracy calibrated five axis device

Three translation axis and two motorized rotations (printheads resolution calibration + substrate alignment)
X and Y stage accuracy < +/- 1.5 µm
Z accuracy < +/- 2 µm
X and Y stage repeatability < +/- 0.5 µm
Z repeatability < +/- 1 µm
Print velocity up to 500 mm/s

Printheads holder: motorized and plug & play

Embeds easily a wide range of printheads with motorized resolution fine tuning and nozzles position self calibration
Print resolution < 5 μm x 5 μm
Printheads number Up to 3 (mixed types)
Printhead types Single nozzle

Low cost Dimatix Cartridges

Drive per nozzle printheads

Dimatix, Konica-Minolta and other on request

(Xaar, Kyocera, Ricoh, Toshiba, Seiko…etc.)

Mounting “Smart door” technology

Accurate fast mount for printheads and its electronics

Ink tank Cartridge 2 mL to 50 mL

Aggressive solvents compatible

Printhead heating Up to 60°C
Printhead Maintenance Automated cleaning station

Substrate holder: motorized vacuum heated chuck

Designed to manage a wide range of substrates for many applications
Size 305 mm x 305 mm
Clamping Vacuum with different areas
Heating Up to 60°C

Mechanical

Machine footprint 1520 mm x 1290 mm x 1800 mm
Machine mean weight 1500 kg
Power 400 V/32A, 3 phases
Certification / Safety CE (UL & CSA on request)

Camera: two devices with different light sources

Two cameras with different light sources to check jetting, to align substrate and to analyze all parts of printed components
Droplet analysis
CCD 1392 x 1040 pixels
Visualization area 1.31 x 1.64 mm
Image analysis Fully automated (DropAnalyser)
Alignement and printed components analysis
CCD 1624 x 1228 pixels
Visualization area 1.79 x 1.35 mm
Alignment types Marks, edge or specific if required
Image analysis Fully automated (FabAnalyser)

Post-treatment aera: to dry and to cure printed layers

Fully integrated and synchronized with the printing for all kindof drying/curing devices
Post-process compatibility IR, UV, AdphosNIR®, Novacentrix PulseForge®, Xenon Sinteron, Vacuum Drying
Substrate management Directly by the manufacturing linear axis to avoid substrate manipulation
Solvent extraction Exhaust connection

OPTIONS

IR Drying Printhead slot
UV Laser reflectometer
AdphosNIR® HEPA filter
Novacentrix PulseForge® Automated refill system (on request)
Other post-treatment Dedicated software add-on
Specific hardware modification Automated Handling (on request)
Automated sheet resistance measurement probe

Software

DropAnalyser: advanced droplets jetting analysis

Real time automated vision software
Waveform tuning Real time, fully open, drive per nozzle
Automation Automatic printheads mapping
Analysis Volume, velocity, jet straightness error

Clogged nozzles detection

Self nozzles positions calibration

Drop to drop variation

Reporting Statistic

Automatic full jetting report creation

FabAnalyser: printed layers analysis and substrate alignment functions

Layers analysis Automated measurements (distance, area)

Automated full printing area acquisition

Thickness measurement with 3D reconstruction (laser reflectometer option required)

Substrate alignment Manual or automatic

Can be fully adapted to customer application

CeraSlice: exclusive printing jobs conception software

Bottom-up approach to import, to edit, to simulate and to sequence the printing of a wide range of printed electronics and smart 3D printing designs
File format Step, DXF, Gerber, GDSII, Bitmap.
Job editing Directly from standard CAD file via CAD/CAM tool
Printing job parameters Fully tunable for each part or under part of the component
Manufacturing script edition Easy and fast, for each step of the printing process (printing vector, nozzle clogging control, alignment, printhead cleaning etc.)
Printing simulation visualization Step by step, materials by materials
Experiment plans Automated experiment plans generation to optimize inkjet process (fully customizable)
Customizable

pre-loaded patterns

Square transistors, circular transistors, multilayer capacitors, induction, coil, etc.

Notre offre

The whole CeraPrinter equipment range is high accuracy multi-material deposition systems with in-line multi- curing technologies, in-situ characterization facilities embedded simultaneously enabling high precision deposition of functional materials and full area curing in each pass.

Evolutionary at lowest cost and delivered with exclusive software suite developed by CERADROP (CeraSlice, DropAnalyser and FabAnalyser) allowing its quick start- up, easy to use and bottom-up approach for functional components design.

To go forward with our customers, we provide strong partnership, highly qualified, responsive worldwide maintenance and support team to provide assistance through each stage of project development.